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Staff Engineer, Advanced Packaging: Layout & Enablement

Job in Boise, Ada County, Idaho, 83701, USA
Listing for: Micron Technology, Inc.
Full Time position
Listed on 2026-10-16
Job specializations:
  • Engineering
    Packaging Engineer
Salary/Wage Range or Industry Benchmark: 120000 - 180000 USD Yearly USD 120000.00 180000.00 YEAR
Job Description & How to Apply Below

Micron Technology, Inc. in Boise, Idaho seeks a Staff Engineer to advance packaging design enablement and layout. You will develop rules, test structures, and layouts for cutting-edge memory technologies while ensuring robust DRC and cross-team alignment.

You will analyze big data, apply AI tools, and collaborate with Process Integration, Product Engineering, Design, and Advanced Mask teams to drive reliable packaging solutions.

For the Staff Engineer, Advanced Packaging:
Layout & Enablement position at Micron Technology, Inc., we are reviewing applications now.

This is a genuine role to take on the Staff Engineer, Advanced Packaging:
Layout & Enablement role at Micron Technology, Inc.

As a Staff Engineer, Advanced Packaging:
Layout & Enablement, you will play an important part at Micron Technology, Inc. in Boise, , United States.

We invite applications for the Staff Engineer, Advanced Packaging:
Layout & Enablement position located in Boise, , United States.

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