Wafer Bonding Equipment Engineer — Lead FAOK Developments
Listed on 2026-10-16
-
Engineering
Electrical Engineering, Process Engineer, Systems Engineer, Electronics Engineer
Micron Technology in Boise, Idaho is seeking an Equipment Development Engineer for Wafer Bonding to lead next‑generation FAOK equipment from concept through manufacturing.
You will own critical hardware development, collaborate with suppliers and cross‑functional teams, and apply modeling, automation, and data analytics to improve overlay, alignment, and bond stability while building a world‑class wafer bonding group.
The following opportunity is for a Wafer Bonding Equipment Engineer — Lead FAOK Developments with Micron.
We would love to welcome a new Wafer Bonding Equipment Engineer — Lead FAOK Developments to our group in Boise, , United States.
For the Wafer Bonding Equipment Engineer — Lead FAOK Developments position at Micron, we are reviewing applications now.
Step into the Wafer Bonding Equipment Engineer — Lead FAOK Developments role at Micron in Boise, , United States and grow with us.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).