Director, Advanced Packaging Process Integration; .5D/3D
Listed on 2026-10-17
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Engineering
Packaging Engineer, Manufacturing Engineer, Process Engineer
Micron Technology in Boise, Idaho is seeking a Process Integration Lead for Advanced Packaging. You will lead a team driving 2.5D/3D packaging development from concept to manufacturing and shape roadmaps for next‑gen platforms while mentoring highly skilled engineers.
You will collaborate with design, process, equipment, reliability, test and manufacturing teams to deliver scalable packaging solutions, optimize yield, and transfer technology into production.
The following position is for a Director, Advanced Packaging Process Integration (2.5D/3D) with Micron.
We are looking to fill the Director, Advanced Packaging Process Integration (2.5D/3D) position at Micron in Boise, , United States.
The Director, Advanced Packaging Process Integration (2.5D/3D) role at Micron is now open for applications in Boise, , United States.
Join us at Micron as our next Director, Advanced Packaging Process Integration (2.5D/3D) in Boise, , United States.
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