Lead FAOK Wafer Bonding Equipment Engineer
Listed on 2026-10-17
-
Engineering
Manufacturing Engineer, Process Engineer, Systems Engineer, Electrical Engineering
Micron Technology in Boise, seeking an Equipment Development Engineer specializing in wafer bonding to drive next‑generation FAOK equipment from concept to manufacturing. You’ll own critical challenges, work with suppliers, and advance precision alignment, overlay, bonding, and automation to push tool capability.
The role demands a hands‑on engineering mindset, strong data analytics, and collaboration across process development, manufacturing, and suppliers to define equipment roadmaps and
Step into the Lead FAOK Wafer Bonding Equipment Engineer role at Micron Technology in Boise, , United States and grow with us.
All applications are reviewed carefully by our team.
The position is based in Boise, , United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 110..
We aim to respond to suitable candidates as soon as possible.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).