Equipment Development Engineer – Wafer Bonding - Technology Development Group

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We’re looking for an engineer who wants to build what comes next!

As an Equipment Development Engineer on Micron’s Wafer Bonding Equipment Development team, you’ll help develop next-generation, first-of-a-kind (FAOK) wafer bonding equipment. We take new ideas from concept to hardware, work directly with equipment suppliers to push system capability, and ultimately put those solutions into technology development and manufacturing.

This is a hands‑on development role with significant technical ownership. You’ll work on precision alignment, overlay, bonding, controls, mechanical systems, automation, equipment data, and new hardware. When today’s equipment can’t meet tomorrow’s requirements, we figure out why and develop a solution!

You’ll work closely with process development, manufacturing, suppliers, and engineering teams across Micron. Together, we’ll solve difficult equipment problems, develop new capabilities, and define the equipment roadmap required for future generations of Micron technology.

You’ll own important equipment‑development challenges from initial concept through manufacturing implementation. That includes developing new equipment and subsystems with suppliers, evaluating new technologies, qualifying hardware, solving difficult equipment problems, and continuously improving tool capability.

• Own wafer bonding equipment performance, capability, reliability, availability, and productivity
• Lead FAOK equipment, hardware, and subsystem development with our suppliers
• Drive improvements in overlay, alignment, bond‑wave behavior, tool matching, defectivity, contamination control, and equipment stability
• Develop equipment requirements, performance budgets, experiments, simulations, and data‑driven solutions
• Use modeling, automation, equipment data, and advanced analytics to understand system behavior and find opportunities others may not see
• Lead equipment evaluations, installations, qualifications, upgrades, and major technical improvements
• Help define our wafer bonding equipment and technology roadmap
• Present technical recommendations and development strategies to engineering teams, suppliers, and leadership
• Share your expertise, mentor other engineers, and help us build a world‑class wafer bonding engineering team
• Demonstrate AI proficiency and utilize AI‑enabled workflows and tools for equipment monitoring, troubleshooting, data analysis, and technical problem solving to improve system performance and engineering productivity.

We’re looking for engineers who enjoy difficult technical problems and want responsibility for solving them.

You should have a bachelor’s degree in Mechanical Engineering, Robotics, Mechatronics, Controls Engineering, Materials Science, Physics, or a related technical field, along with 4+ years of semiconductor equipment, process, manufacturing, or related engineering experience.

You should be comfortable troubleshooting complex equipment, analyzing data, working across engineering disciplines, and driving technical projects to completion. Experience with precision alignment, overlay, modeling, or complex electromechanical systems is highly valued.

Experience with wafer‑to‑wafer fusion or hybrid bonding; precision alignment and overlay; motion control; semiconductor equipment development;
Python or MATLAB; equipment data and SECS/GEM; sensors and…