Staff Engineer, Advanced Packaging – AI-Driven Innovation
Listed on 2026-10-17
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Engineering
Packaging Engineer
Micron Technology is seeking a seasoned design engineer to join our advanced packaging team in Idaho. You will develop design rules, test structures, and layouts to support technology development and drive robust DRC processes.
You will analyze large data sets, apply AI to shorten development cycles, and collaborate across Process Integration, Product Engineering, Design, and Advanced Mask teams. This full-time role requires 5+ years in semiconductor packaging and strong Python/MATLAB data
We would love to welcome a new Staff Engineer, Advanced Packaging – AI-Driven Innovation to our organisation in Boise, , United States.
All applications are reviewed carefully by our team.
The position is based in Boise, , United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 140..
We aim to respond to suitable candidates as soon as possible.
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