Lead Memory Package Design Engineer
Listed on 2026-10-17
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Engineering
Packaging Engineer, Systems Engineer
Micron Technology, Inc. is seeking a Senior Package Design Engineer to lead advanced memory packaging initiatives.
You will drive floor planning, high-density routing, and package layouts from concept through high-volume manufacturing, partnering with silicon teams, OSATs, and supply chains. You will leverage SI/PI simulations, optimize substrate stack-ups, and guide DFMEAups to ensure robust, scalable designs for AI, data center, and edge applications.
We have an opening for a Lead Memory Package Design Engineer in Boise, , United States within Engineering.
This role is for the Lead Memory Package Design Engineer role at Micron Technology, Inc.
We are seeking a motivated Lead Memory Package Design Engineer to join Micron Technology, Inc. in Boise, , United States.
Consider building your career as a Lead Memory Package Design Engineer at Micron Technology, Inc.
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