Staff Engineer, Advanced Packaging: Edge Trim & Backgrind
Listed on 2026-10-17
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Engineering
Packaging Engineer
Micron Technology, Inc. in Idaho seeks a Staff Engineer to join the Advanced Packaging Technology Development (APTD) team.
You will help develop and scale wafer edge trim, backgrind, and thinning processes for next-generation memory products, collaborating across process areas and enabling production readiness. The role emphasizes hands-on R&D, data-driven optimization, and multi-project management with potential travel.
The Staff Engineer, Advanced Packaging:
Edge Trim & Backgrind role at Micron Technology, Inc is now open for applications in Boise, , United States.
The Staff Engineer, Advanced Packaging:
Edge Trim & Backgrind position in the IT & Technology, Engineering field is open for applications.
We have an opening for a Staff Engineer, Advanced Packaging:
Edge Trim & Backgrind in Boise, , United States within IT & Technology, Engineering.
This role, Staff Engineer, Advanced Packaging:
Edge Trim & Backgrind at Micron Technology, Inc, could be your next move.
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