Advanced Packaging Development Engineer – AI-Driven
Listed on 2026-10-17
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Engineering
Packaging Engineer, Product Engineer
Micron Technology, a world leader in memory and storage solutions, seeks a Design Engineer in Boise, Idaho. You will develop and refine Design Rules, requirements, and test structures for advanced packaging, create layout and D test vehicles, and ensure robust DRC responses.
You will analyze large datasets, apply AI tools to accelerate development, and collaborate across Process Integration, Product Engineering, Design, and Advanced Mask teams.
As a Advanced Packaging Development Engineer – AI-Driven, you will play an important part at 1000 Micron Technology, Inc. in Boise, , United States.
If your experience matches this role, we encourage you to apply.
All applications are reviewed carefully by our team.
The position is based in Boise, , United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 85..
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