Lead Mechanical & Thermal Engineer AI HPC Cooling
Listed on 2026-10-17
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Engineering
Mechanical Engineer
Micron Technology, Inc. is seeking a highly experienced Mechanical & Thermal Engineer to drive the mechanical and thermal architecture of cutting-edge memory hardware. The role involves leading design, validation, and testing of cooling solutions across multi-disciplinary teams.
You will influence product strategy, mentor engineers, and champion AI-enabled engineering workflows for simulation and optimization in a fast-paced semiconductor environment.
We would love to welcome a new Lead Mechanical & Thermal Engineer for AI HPC Cooling to our organisation in Boise, , United States.
Take a moment to read everything above and see whether this role is right for you.
This posting is for the Lead Mechanical & Thermal Engineer for AI HPC Cooling role at Micron Technology, Inc., based in Boise, , United States.
We are looking to fill the Lead Mechanical & Thermal Engineer for AI HPC Cooling position at Micron Technology, Inc. in Boise, , United States.
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