Memory Architect Gen AI & Datacenter
Listed on 2026-10-18
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Engineering
Systems Engineer, Hardware Engineer -
IT/Tech
Systems Engineer, Hardware Engineer
Micron Technology, Inc. in Boise seeks a Memory Package Integration Architect to define next-generation memory packaging architectures, driving cross‑stack optimization across silicon, package and system for high-speed datacenter and edge-AI memory products.
You will work with silicon, electrical, thermal and mechanical teams, interfacing with customers and senior leaders to guide long-term technology roadmaps and disruptive packaging innovations.
This role, Memory Package Architect — Next-Gen AI & Datacenter at Micron Technology, Inc, could be your next opportunity.
All applications are reviewed carefully by our team.
The position is based in Boise, , United States.
This opportunity is part of our work in IT & Technology, Engineering.
The advertised compensation is 143..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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