DRAM Process Integration Engineer - 3D Memory R&D
Listed on 2026-10-18
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Engineering
Process Engineer, Electronics Engineer
Micron Technology, Inc. in Boise requires a process integration engineer (PhD candidate) focused on 3D DRAM technology to improve device performance and manufacturability. You will work with cross-functional teams across development, design, and yield to solve complex integration challenges.
The role emphasizes experiments, data analysis, and collaboration, with the aim of advancing memory scaling and reliability in a cutting-edge 300mm R&D environment.
Consider building your career as a DRAM Process Integration Engineer - 3D Memory R&D at Micron Technology, Inc.
All applications are reviewed carefully by our team.
The position is based in Boise, , United States.
This opportunity is part of our work in IT & Technology, Engineering.
The advertised compensation is 42.000 - 64.000.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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