Edge Trim & Backgrind R&D Engineer, Advanced Packaging
Listed on 2026-10-18
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Engineering
Packaging Engineer
Micron Technology, Inc. in Boise, seeking an engineer for Advanced Packaging R&D focused on wafer edge trim, backgrind and thinning processes.
You will work closely with process integration and adjacent areas to drive capability, yield, and reliability in next-generation memory products. You will perform structured experimentation, data analysis, and root-cause investigations to enable ultra-thin wafer processing.
We are currently recruiting a Edge Trim & Backgrind R&D Engineer, Advanced Packaging for our team in Boise, , United States.
We invite applications for the Edge Trim & Backgrind R&D Engineer, Advanced Packaging position located in Boise, , United States.
The following position is for a Edge Trim & Backgrind R&D Engineer, Advanced Packaging with Micron Technology, Inc.
Our team is growing, and we are hiring a Edge Trim & Backgrind R&D Engineer, Advanced Packaging in Boise, , United States.
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