Advanced Packaging Process Integration Engineer
Listed on 2026-10-18
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Engineering
Manufacturing Engineer, Process Engineer, Packaging Engineer, Quality Engineering
Micron Technology, Inc. in Boise, Idaho, is seeking a Process Integration Engineer for Advanced Packaging. You will develop and integrate 2.5D/3D packaging, including HBM and hybrid bonding, working across disciplines to improve performance and yield.
Responsibilities include experiments to qualify materials and processes, data-driven yield analysis, and technology transfer to manufacturing. Collaboration with design, process, reliability, and manufacturing teams is essential to deliver
We are currently recruiting a Advanced Packaging Process Integration Engineer for our team in Boise, , United States.
Step into the Advanced Packaging Process Integration Engineer role at Micron Technology, Inc. in Boise, , United States and grow with us.
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