Equipment Engineer – Advanced Packaging
Listed on 2026-10-18
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Engineering
Manufacturing Engineer, Process Engineer, Packaging Engineer, Electronics Engineer
Micron Technology, Inc. in Boise, Idaho is seeking a Staff Equipment Development Engineer to develop and optimize next-generation wafer and die equipment in the APDT team. You will drive hardware maturity, collaborate with process development, and lead cost-reduction initiatives across R&D and manufacturing.
The role requires a Master’s degree or equivalent in a technical field, 2+ years in semiconductor equipment, and experience with DOE/SPC. Preference for PhD and robotics/AI familiarity.
Are you ready to take on the Staff Equipment Engineer – Advanced Packaging role at Micron Technology, Inc.?
We are currently recruiting a Staff Equipment Engineer – Advanced Packaging for our team in Boise, , United States.
This is a genuine position to take on the Staff Equipment Engineer – Advanced Packaging role at Micron Technology, Inc.
As a Staff Equipment Engineer – Advanced Packaging, you will play an important part at Micron Technology, Inc. in Boise, , United States.
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