DRAM Front-End Process Integration Engineer
Listed on 2026-10-20
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Engineering
Electronics Engineer, Process Engineer, Systems Engineer, Manufacturing Engineer
Micron Technology, Inc. in Boise, Idaho is seeking a DRAM Device & Process Integration Engineer to drive front-end FEOL integration for next‑generation memory nodes, own integration schemes, DOEs, and learning from development through transfer to manufacturing.
You will work with Process Development, Device Engineering, Yield, and Manufacturing teams; apply device modeling (TCAD/Silvaco/Sentaurus) to guide experiments; analyze inline and yield data; and define milestones to ensure successful
This posting is for the DRAM Front-End Process Integration Engineer role at Micron Technology, Inc., based in Boise, , United States.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the DRAM Front-End Process Integration Engineer role in the description above.
We appreciate your interest in this position.
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