Lead Substrate Technologist, Packaging & Roadmaps
Listed on 2026-11-01
-
Engineering
Packaging Engineer
Apple, Inc. in the San Francisco Bay Area is seeking a substrate packaging expert to own the package substrate development from concept to high-volume manufacturing.
You will drive roadmap definition and work with suppliers across the supply chain to optimize performance, cost, and availability. The role requires a Bachelor's degree (MS/PhD preferred) with strong fundamentals in materials or mechanical engineering and hands-on substrate manufacturing experience, including Cu plating and
We would love to welcome a new Lead Substrate Technologist, Packaging & Roadmaps to our organisation in United States.
We are seeking a motivated Lead Substrate Technologist, Packaging & Roadmaps to join Apple, Inc. in United States.
Consider building your career as a Lead Substrate Technologist, Packaging & Roadmaps at Apple, Inc.
The Lead Substrate Technologist, Packaging & Roadmaps position in the Engineering, Other field is open for applications.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).