CMOS Device Integration Leader ‑Gen Memory
Listed on 2026-11-02
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Engineering
Electronics Engineer, Systems Engineer, Hardware Engineer
Micron Technology in Boise, Idaho seeks a Distinguished Member of Technical Staff to lead CMOS device integration for next-generation DRAM and memory architectures. The role requires coordinating across Design, TCAD, Modeling, Process, Reliability, and Layout teams to deliver integrated technology solutions.
The candidate will provide technical leadership, strategic recommendations, and clear presentations to guide technology direction.
This role, CMOS Device Integration Leader for Next‑Gen Memory at Micron Technology, Inc., could be your next opportunity.
Are you ready to take on the CMOS Device Integration Leader for Next‑Gen Memory role at Micron Technology, Inc.?
We would love to welcome a new CMOS Device Integration Leader for Next‑Gen Memory to our team in Boise, , United States.
For the CMOS Device Integration Leader for Next‑Gen Memory position at Micron Technology, Inc., we are reviewing applications now.
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