Principal Engineer, HBM Tapeout & Release Lead
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Engineering
Job Description & How to Apply Below
Micron Technology, Inc. in Richardson, Texas is seeking a Principal Engineer to lead HBM tapeout execution and coordinate release processes.
You will collaborate with design, foundry, and QA teams to ensure tapeouts proceed on schedule, with rigorous attention to timing, signal integrity, and process controls. The ideal candidate brings advanced experience in memory IP, tapeout flows, and release coordination, with a track record of delivering complex IC projects on time in a fast-paced
Our team is growing, and we are hiring a Principal Engineer, HBM Tapeout & Release Lead in Boise, , United States.
This is a great opportunity to take on the Principal Engineer, HBM Tapeout & Release Lead role at Micron Technology, Inc.
As a Principal Engineer, HBM Tapeout & Release Lead, you will play an important part at Micron Technology, Inc. in Boise, , United States.
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