DRAM Process Integration Engineer — Shape -Gen Memory
Listed on 2026-11-04
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Engineering
Process Engineer, Manufacturing Engineer, Electronics Engineer, Materials Engineering
Micron Technology in Boise, Idaho, is seeking a Process Integration Engineer for its DRAM R&D Memory Group to advance next-generation memory technology. You will develop structural and electrical requirements for modules and collaborate with Design, Process Development, Yield, and Manufacturing to transfer new solutions into production.
Responsibilities include designing new process flows, specifying design rules, running DOE studies, and using data analysis to improve yield and reduce cost.
We would love to welcome a new DRAM Process Integration Engineer — Shape Next-Gen Memory to our organisation in Boise, , United States.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the DRAM Process Integration Engineer — Shape Next-Gen Memory role in the description above.
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