HBM Product Failure Analysis Engineer - New Grad
Listed on 2026-11-05
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Engineering
Quality Engineering, Electronics Engineer, Test Engineer
Micron Technology, Inc. is seeking a New College Grad HBM PYE Product Development Failure Analysis Engineer to join the PDFA team.
You will focus on reliability and component-level failure analysis during new HBM introductions, using electrical, physical, and AI-driven data methods to uncover failure mechanisms and enable rapid production ramp. You will collaborate with Product, Process, Quality, and Test Engineering to translate complex data into actionable engineering solutions, supporting
We invite applications for the HBM Product Failure Analysis Engineer
- New Grad position located in Boise, , United States.
We have an opening for a HBM Product Failure Analysis Engineer
- New Grad in Boise, , United States within Engineering.
This role, HBM Product Failure Analysis Engineer
- New Grad at Micron Technology, Inc., could be your next move.
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