Director, APTD Die Level Technology Process Development Posted

Position: Director, APTD Die Level Technology Process Development  United States of America Posted a day ago
## Director, APTD Die Level Technology Process Development Boise, Idaho, United States of America Apply Now Use AI to find out how well you match with this jobJob :
JR112474
** Our vision is to transform how the world uses information to enrich life for
* all*.
** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team!  We are seeking an experienced organizational leader who will lead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation.

In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‐to‐end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration.  
** Responsibilities:*
* * Own advanced packaging process technologies across wafer‐level and die‐level modules from pathfinding through manufacturing readiness
* Develop and mature novel process flows, materials, and integration schemes that meet electrical, mechanical, thermal, cost, and reliability needs
* Lead FOAK development, supplier engagement, and ecosystem collaboration to close capability gaps and accelerate learning
* Drive structured problem solving for multi‐domain technical challenges and guide strategic decisions across programs
* Lead technology transfer to manufacturing and influence packaging and integration decisions across product teams
* Expected to leverage AI-enabled tools, automation, data analytics, and advanced modeling methods to accelerate process development, strengthen decision-making, and improve technical outcomes across advanced packaging programs.  
*
* Minimum Qualifications:

*
* * MS in Chemistry, Chemical Engineering, Materials Science, or related field (or equivalent experience)
* 15+ years in semiconductor process development, manufacturing, or advanced packaging
* Deep expertise in wafer‐level or die‐level processes such as CMP, etch, cleans, thin films, lithography, hybrid bonding, TCB, dicing, or molding
* Strong understanding of semiconductor process integration and materials interactions
* Proven experience leading complex cross‐functional technical programs  
*
* Preferred Qualifications:

*** PhD in a relevant technical field
* Extensive experience with advanced memory technologies or 3D packaging architectures
* Experience mentoring other engineers and driving technical methodology improvements
* Familiarity with materials characterization and simulation (thermal, mechanical, electrical)
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  

Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury,…