Senior Silicon Photonics Engineer

Base pay range

$/yr - $/yr

Annual Bonus and Stock options

NOTE:

Please apply through Linked In.

Analog Photonics is a Boston-based silicon photonics company developing high-performance photonic integrated circuits (PICs) that enable disruptive advances in automotive LiDAR, optical communications, consumer electronics, and defense systems. Our proprietary silicon photonics platform delivers compact, scalable, and manufacturable solutions that push the limits of speed, integration density, and optical performance.

At Analog Photonics, you will find not only a fast-paced environment driving world-leading solid-state LiDAR systems and advanced communication links, but also an environment that encourages you to develop multiple skill sets across design, simulation, fabrication, packaging, and testing. Engineers work hands-on across the full design-build-test cycle, and your contributions will have a direct path from concept to prototype to system deployment.

We are seeking a Senior Silicon Photonics Engineer to join our multidisciplinary photonics team. This role involves leading the design and verification of advanced photonic devices and contributing directly to the development of our silicon photonics PDK. You will also play a central role in the creation of world‑leading solid‑state LiDAR systems, as well as other high‑performance PIC‑based solutions for communications, consumer, and defense applications.

Candidates should be eager to engage deeply with device physics, modeling, and system integration, and to collaborate across CMOS, electronics, packaging, and system teams to solve end‑to‑end photonics challenges.

• Lead design, modeling, and layout of silicon and III‑V/silicon photonic devices (modulators, photodetectors, couplers, resonators, grating antennas, etc.).
• Contribute to the development, validation, and maintenance of the Analog Photonics silicon photonics PDK.
• Perform device‑and system‑level testing, including wafer‑scale optical characterization and high‑speed electrical/optical measurements.
• Interface with foundries for tapeouts (full‑reticle and MPW), ensuring manufacturable and DRC‑compliant layouts.
• Collaborate with packaging engineers on chip‑to‑fiber and chip‑to‑system integration (e.g., butt coupling, OPA‑based couplers, AR‑coated optics).
• Develop measurement automation and analysis pipelines in MATLAB/Python for large datasets.
• Deliver high‑quality technical reports and presentations for design reviews, customer programs, and government deliverables.
• Support next‑generation solid‑state LiDAR and high‑speed communication systems through device and subsystem innovation.
• Contribute to proposals and technical strategy for new research and product development.

• M.S. with 3+ years of industry experience, OR Ph.D., in Electrical Engineering, Applied Physics, or related field.
• Strong background in integrated photonics device and system design, with demonstrated experience in:
• Electromagnetic simulations (Lumerical FDTD/Mode, Synopsys, COMSOL).
• Mask layout (Cadence Virtuoso, KLayout) and DRC‑compliant tapeouts.
• Experimental testing of photonic devices with tunable lasers, wafer probers, and alignment systems.
• Proficiency in MATLAB/Python for data analysis and automation

• High‑speed RF/electro‑optic device design and testing (≥25 GHz).
• III‑V photonic device design and hybrid integration.
• Wafer‑scale testing automation and instrument automation.
• Advanced photonic packaging (flip‑chip bonding, fiber arrays, co‑packaged optics).
• Experience in vendor/customer communication.
• Publications in leading photonics journals

Mid‑Senior level

Full‑time

Engineering, Research, and Science

Semiconductor Manufacturing, Research Services, and Nanotechnology Research

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