Senior Flip-Chip Packaging Engineer, .5D/3D
Listed on 2026-10-07
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Engineering
Packaging Engineer
Conductor seeks experienced engineers to contribute to flip chip package development and assembly for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This role covers bump metallurgy, substrate integration, reflow, underfill, reliability, and cross-functional support for package and system productization.
Responsibilities include developing attach processes, defining bump stacks, enabling die-to-substrate integration, and mitigating risks such as warpage and voiding.
As a Senior Flip-Chip Packaging Engineer, 2.5D/3D, you will play an important part at Conductor in Boston, MA, United States.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Senior Flip-Chip Packaging Engineer, 2.5D/3D role in the description above.
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