Lead Wafer-Level Molding & Underfill Engineer
Listed on 2026-11-04
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Engineering
Process Engineer, Quality Engineering
Volantis Semiconductor, Inc. is seeking a hands-on Process and Materials Engineer to own wafer level molding and underfill processes across development and manufacturing.
You will lead mold compound selection, MUF development, and cross-functional support to enable robust packaging from concept to high-volume production. The role requires deep know-how in molding technologies, capillary underfill, cure profiling, and reliability testing, with collaboration across design, reliability, thermal,
This role is for the Lead Wafer-Level Molding & Underfill Engineer role at Volantis Semiconductor, Inc.
Join us at Volantis Semiconductor, Inc. as our next Lead Wafer-Level Molding & Underfill Engineer in Boston, MA, United States.
We are currently recruiting a Lead Wafer-Level Molding & Underfill Engineer for our team in Boston, MA, United States.
This is a strong position to take on the Lead Wafer-Level Molding & Underfill Engineer role at Volantis Semiconductor, Inc.
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