Firmware Systems Engineering Manager, SmartSense; Boston, MA or Hopkins, MN - Hybrid

Firmware Systems Engineering Manager, Smart Sense (Boston, MA or Hopkins, MN - Hybrid)

Smart Sense, a Digi International business, provides end‑to‑end IoT solutions that help organizations monitor critical operations across healthcare, food safety, life sciences, and supply chain. Our platform combines wireless sensors, intelligent gateways, and cloud software to deliver real‑time visibility and automated compliance at enterprise scale.

We are seeking an Embedded Firmware Systems Engineering Manager to lead and grow the team responsible for developing the firmware that powers Smart Sense’s next‑generation IoT sensors and gateway platforms. This role combines senior‑level technical leadership with hands‑on engineering. You will define system architecture, guide firmware execution, and contribute directly to code development.

Opportunity to help define the embedded technology that powers one of the industry’s most trusted IoT platforms. Shape the direction of device architecture and product capabilities while growing a high‑performing engineering team.

• Lead system‑level engineering across MCU firmware, embedded Linux, connectivity pipelines, and device‑cloud interfaces.
• Define and evolve platform architecture including wireless stacks, OTA update systems, low‑power design, telemetry, and performance.
• Contribute hands‑on to firmware development in C/C++, RTOS environments, embedded Linux services, and edge compute components.
• Ensure fleet KPIs including connectivity stability, uptime, power efficiency, and OTA reliability.
• Work closely with Hardware Engineering on sensor interfaces, radio integration, manufacturability, and system validation.
• Drive CI/CD automation, secure coding practices, test infrastructure, and engineering processes.
• Debug complex issues across MCU, Linux, RF, sensors, and hardware interfaces using advanced diagnostic tools.
• Mentor, develop, and coach firmware engineers to build a strong, scalable engineering organization.
• Partner with Product, Cloud, QA, and Operations to ensure predictable delivery and cross‑team alignment.

• 10+ years of embedded systems or firmware engineering experience, including real‑time MCU development.
• 1+ years of engineering leadership with strong delivery and quality outcomes.
• Expert proficiency in embedded C/C++, RTOS architectures, device drivers, and low‑power IoT system design.
• Strong background in embedded Linux (Yocto, Ubuntu) and device service development.
• Experience with CI/CD pipelines, Git, Jenkins, Docker, and secure software development practices.
• Strong knowledge of wireless protocols such as BLE, Zigbee, LTE, and device‑cloud communication.
• Skilled in debugging across hardware, firmware, Linux, and RF domains.
• Experience with at least one major cloud IoT platform – AWS IoT, Azure IoT, or Google Cloud – is required.
• Based in the Greater Boston area with the ability to work hybrid onsite.

• Experience with Digi XBee modules, cellular gateways, or large‑scale IoT telemetry architectures.
• Knowledge of RF tuning, sensor system design, or power optimization.
• Exposure to compliance or regulatory frameworks.

The anticipated base pay range for this position is $122,500 – $191,500. Pay ranges are determined by role, job level, and primary job location.

Short‑term incentive program, new hire stock award, paid parental leave, open (uncapped) PTO, hybrid work environment, competitive medical, health & wellbeing, and compensation offerings.

We are unable to provide visa sponsorship for this position. Candidates must have valid work authorization in the United States at the time of application.

At Digi, we embrace diversity and inclusion. We are committed to providing an environment of respect where equal employment opportunities are available to all applicants and teammates. This employer is required to notify all applicants of their rights pursuant to federal employment laws. For further information, please review the Know Your Rights notice from the Department of Labor.