Sr. Mechanical Engineer

Mesa Quantum is building the manufacturing backbone of the quantum economy. We specialize in chip-scale quantum devices, starting with clocks and sensors, that unlock resilient Position, Navigation, and Timing (PNT) for defense, telecom, space, and critical infrastructure. Our team combines world-class expertise in AMO physics, photonics, microfabrication, and engineering to transform breakthrough science into scalable, deployable technology. Backed by top-tier deep-tech investors and the U.S. Department of Defense, Mesa Quantum is rapidly scaling and actively recruiting exceptional innovators who want to build the future of quantum technology from the ground up.

We are seeking a hands-on Senior Mechanical Engineer to lead the mechanical and thermal design of our chip-scale atomic clock, from physics package and electronics integration through enclosure and production. You will reduce size, weight, power, and cost (SWaP-C) while ensuring stability and reliability under demanding environmental conditions. You will model, build, and test prototypes, then work with cross-functional teams and manufacturing partners to transition designs into production.

• Own system-level mechanical architecture, CAD design, drawings, prototypes, and production release.
• Manage mass, volume, and power budgets; run trade studies to reduce SWaP-C without compromising clock stability.
• Develop thermal designs and models for the vapor cell, laser, and electronics, and correlate predictions with test data.
• Design for shock, vibration, and thermal cycling; plan and execute environmental tests and implement improvements.
• Develop vacuum or hermetic packaging, magnetic shielding, and precision alignment for optics and other sensitive components.
• Drive design for manufacturing and assembly, supplier collaboration, assembly documentation, and production readiness.
• Collaborate with physics, photonics, electrical, firmware, and manufacturing teams on current and next-generation clock designs.

• BS in Mechanical Engineering with 8+ years of relevant experience, or MS/PhD with 5+ years.
• Advanced Solid Works or Creo skills, including production drawings and GD&T.
• Experience with thermal and structural FEA using tools such as ANSYS, COMSOL, or Solid Works Simulation, validated against test data.
• Hands-on experience with thermal management, precision hardware, and ruggedization for shock and vibration.
• Experience designing small hardware from prototype through production, including vacuum or hermetic packaging and leak testing.
• Ability to build and test prototypes, document designs clearly, and work directly with machine shops, vendors, and contract manufacturers.

• Experience with atomic clocks, quantum sensors, magnetometers, or atomic interferometers.
• Rugged electronics for defense, aerospace, or space applications, including environmental qualification.
• Low-power thermal design, vacuum insulation, or low-emissivity coatings.
• MEMS or microelectronics packaging, magnetic shielding, laser or photonics packaging, and optical alignment.
• Experience with electronics cooling tools, ECAD/MCAD collaboration, PLM systems, or early-stage hardware companies.

Due to U.S. Department of Defense funding requirements, applicants must be U.S. persons (U.S. citizens or lawful permanent residents). The ability to obtain and maintain a U.S. security clearance may be required for certain projects.

• Base salary of $140,000 to $195,000, depending on experience and qualifications.
• Meaningful equity and a comprehensive benefits package.
• The opportunity to own critical product design at the intersection of quantum technology, photonics, and advanced engineering.
• A collaborative team with deep expertise in AMO physics, RF, photonics, and microfabrication, based in Boulder, Colorado.