Lead Photonic Packaging Engineer
Listed on 2026-10-06
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Engineering
Packaging Engineer
PHIX is seeking a Photonic Packaging Engineer in Bozeman, MT to advance PIC packaging and assembly processes. You will lead customer projects, translate requirements into precise designs, and partner with engineers to improve manufacturability.
The role emphasizes hands-on packaging, process innovation, and scalable automation, with collaboration across an enthusiastic international team and opportunities to contribute to cutting-edge photonic technologies.
This is a genuine opening to take on the Lead Photonic Packaging Engineer role at PHIX.
All applications are reviewed carefully by our team.
The position is based in Bozeman, MT, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 90..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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