Failure Analysis Engineer

Position: Staff Failure Analysis Engineer
Location:

Burlington, ON. (On-Site)

The Staff Failure Analysis Engineer is responsible for performing package and die level failure analysis of analog and mixed signal ICs from customer returns and internal failures. Internal failures may include rejects from Quality and Reliability Qualification, Test Manufacturing Line, Design and New Product Characterization failures, etc. Results of the analysis must be documented through a formal technical report.

Responsibilities

Perform package and die level failure analysis of customer returns and internal failures. (60%)

Generate formal FA reports for customers and internal requestors to summarize and communicate the technical analysis results. (15%)

Work with various engineering teams such as QA & Reliability, Design, Applications, Wafer Fab, Assembly, Product and Test Engineering as appropriate, for root cause analysis and resolution of customer and internal issues. (15%)

Participate in continuous FA technique development and process improvements, monitoring and maintenance of laboratory supplies and consumables, optimization and maintenance of laboratory tools and equipment. (10%)

Minimum Qualifications

Bachelor’s degree in Engineering Physics, Electrical or Electronics Engineering.

At least 3 years experience in semiconductor IC Failure Analysis.

Must have hands‑on experience in operating the following FA equipment:
Curve Tracer/Parametric Analyzer, Scanning Acoustic Microscope, SEM/EDX, Photon Emission/Laser Signal Injection Microscope, Microprober.

Must have hands‑on experience in performing the following physical FA steps: chemical decapsulation/deprocessing/staining, mechanical/parallel lapping, mechanical cross‑sectioning and polishing.

Proficient in bench testing and instrumentation.

Knowledge in IC fabrication, semiconductor physics, BJT and MOSFET theories and basic circuit configurations.

Strong verbal and written communication skills, analytical and problem solving skills, teamwork and cross‑functional team coordination.

Willing and able to work non‑traditional hours as needed to meet urgent customer requests — for example, weekend support to address time‑sensitive customer needs.

Willing and able to work in a laboratory environment onsite.

Proficient in MS Word, PowerPoint and Excel.

Desired Qualifications

Experience in FIB X‑sectioning, Circuit Edit and ion milling techniques.

Additional experience in the following engineering disciplines:
Product Quality and Reliability, Test/Product Engineering, Design/Validation/Characterization, Applications, and Wafer Fab.

A reasonable estimate of the pay range for this position is $88,000 - $110,000. There are several factors taken into consideration in determining base salary, including but not limited to: job‑related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.

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