Principal Engineer Signal Integrity

Position: Principal Engineer for Signal Integrity
Lead the way in IC Package Design at Semtech as a Principal Engineer focused on Signal Integrity. Your experience in high-speed transmission and collaborative design will be vital in this pivotal role.

Join Semtech's Signal Integrity Products team to spearhead the design and characterization of high-speed packages for data communications.

Your role encompasses advanced modeling and cross-functional collaboration to ensure excellent quality and reliability. This is an extraordinary chance to contribute to the evolution of data center technologies.

Key Responsibilities:

• Oversee design and development of IC packages and COB solutions

• Conduct 3D signal integrity modeling, validating with TDR and S-parameter testing

• Write technical reports for both internal and external stakeholders

• Create PCB layouts for performance and reliability

• Mentor junior engineers in design methodologies and tools

Requirements:

• Bachelor's degree in Electrical Engineering or related field

• Over 8 years of experience in signal integrity or IC package design

• Proficiency with EDA tools and measurement equipment

• Familiarity with various advanced packaging methods

• Ability to manage technical relationships with suppliers

Your expertise will help shape a new era in high-performance connectivity products at Semtech.
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