Principal Electrical Engineer

Principal Electrical Engineer

Oracle's Cloud Infrastructure (OCI) Hardware Development organization seeks a talented and hands-on Principal Electrical Engineer to join our team in Burlington, MA. Here is your opportunity to help shape the architecture, detailed design, bring‑up, and delivery of next‑generation, high‑end GPU servers and infrastructure platforms powering Oracle's fast‑growing public cloud, AI, and enterprise offerings.

You will be a key member of a focused, high‑impact hardware team working directly alongside experts in signal and power integrity, system validation, CAD, firmware, diagnostics, operations, and mechanical engineering. This is a highly collaborative and technically demanding role where you'll be closely involved from initial concept and requirements through prototype design, hands‑on lab bring‑up, debug, validation, and transition to full mass production.

The position is based on‑site in Burlington engineering campus.

We offer the unique excitement of designing in‑house products for massive scale, with full design ownership and opportunities for mentoring, technical leadership, and direct impact on Oracle's next‑generation cloud technologies.

• Lead parts selection and qualification for high‑performance x86/ARM CPUs, GPUs, FPGAs, advanced memory, VRDs, network and storage controllers, and supporting components.
• Perform schematic capture and board floor planning for complex, multi‑processor server boards using industry‑standard CAD tools (Cadence, Concept, Allegro).
• Provide guidance and collaborate closely with CAD designers for component placement, routing, and review of schematic and PCB layout, ensuring best practices and performance targets.
• Author, maintain, and publish accurate and comprehensive hardware specifications, bills of materials, configuration guides, and all necessary technical documentation.
• Develop, implement, and automate test plans and validation strategies at the board and system level; bring up and thoroughly validate prototypes.
• Collaborate with Signal Integrity (SI) and Power Integrity (PI) engineers for pre‑layout and post‑layout simulation, planning, and problem solving.
• Work hands‑on in the Burlington hardware lab for prototype bring‑up, rework, debug, and analysis using oscilloscopes, logic analyzers, and SI/PI test tools.
• Lead and participate in formal, cross‑functional design reviews; set technical direction, ensure all requirements are addressed, and foster a culture of technical excellence.
• Conduct root‑cause analysis and debug of highly complex hardware problems; drive swift resolution of customer escalations, component changes, sustaining engineering, and end‑of‑life transition issues.
• Integrate high‑speed interfaces such as PCIe Gen5/Gen6, DDR5/DDR6, Intel UPI, AMD xGMI, multi‑gigabit Ethernet, advanced VRDs, and common sideband/control buses (SPI, I2C/I3C, GPIO, etc.).
• Partner with firmware/software, diagnostics, system test/validation, operations, supply chain, and mechanical engineering teams to deliver manufacturable, scalable products ready for cloud‑scale deployment.
• Mentor and support junior engineers, foster cross‑team knowledge sharing, and contribute to interviews and talent development initiatives.
• Participate in thought leadership, innovation, and continuous improvement programs, keeping abreast of trends in server hardware, cloud infrastructure, and AI platforms.
• Provide technical leadership and hands‑on execution through all product life cycle phases – architecture, detailed design, bring‑up, debug, validation, production, and sustaining.

• Bachelor's degree (or higher) in Electrical Engineering, Computer Engineering, or equivalent; MS or PhD preferred.
• Minimum of 13 years (BS), 11 years (MS), or 9 years (PhD) relevant experience in board‑level/electrical hardware engineering for enterprise‑class server or high‑speed compute platforms.
• Hands‑on expertise in:
  • Schematic capture, board floor planning, and high‑performance multi‑layer board design for servers or data centers.
  • Deep knowledge and real‑world application of constraint‑driven design, signal integrity, power integrity, and PCB stackup…