Packaging Specialist II

D-Wave Quantum Inc. (NASDAQ: QBTS) is a leader in the development and delivery of quantum computing systems, software, and services. It is the world’s first commercial supplier of quantum computers, and the first and only to offer dual-platform quantum computing products and services, spanning both annealing and gate-model quantum computing technologies. D-Wave’s mission is to help customers realize the value of quantum today through enterprise-grade systems available on-premises and via its Leap quantum cloud service, which offers 99.9% availability and uptime.

More than 100 organizations across commercial, government, and research sectors trust D-Wave to address complex computational challenges using quantum computing. Learn more about realizing the value of quantum computing today and how D-Wave is shaping the quantum-driven industrial and societal advancements of tomorrow:

D-Wave is seeking an experienced Packaging Specialist II to join our Cryogenic Packaging Team.

In this role, you will support the development and refinement of cryogenic packaging processes, materials, and assembly techniques through hands‑on experimentation and prototype development. You will build and evaluate experimental hardware, troubleshoot assembly challenges, and contribute practical expertise to the development of next‑generation packaging technologies.

You will work closely with scientists, engineers, and technicians to evaluate new designs, identify manufacturability and cryogenic reliability concerns, and help transition successful experimental processes into robust, repeatable manufacturing techniques.

• Support evaluate new packaging materials, processes, and designs through hands‑on experimentation
• Build experimental hardware and prototypes to support next‑generation cryogenic packaging technologies
• Participate in speculative packaging concepts and look‑ahead prototypes to explore future manufacturing capabilities
• Support evaluate chip package designs, and assist in identifying manufacturability and cryogenic reliability concerns’ elevate assembly challenges to senior team members for resolution
• Execute packaging materials, fabrication, and design trials, documenting observations and helping refine manufacturing methods
• Assist in documenting packaging assembly techniques and work instructions
• Maintain accurate experimental records, process documentation, and traceability of materials, assemblies, and process changes
• Collaborate with scientists, engineers, and technicians to transition successful processes into repeatable manufacturing techniques
• Read and interpret engineering drawings, assembly instructions, process documentation, and experimental procedures
• Assemble, inspect, rework, and repair cryogenic electronic assemblies, including die attach, wire bonding, cable assemblies, and other precision microassembly operations
• Perform precision inspection and verification using microscopes and specialized laboratory equipment
• Follow safety protocols and maintain specialized tools, equipment, and laboratory work areas
• Provide general laboratory maintenance and support

• Post‑secondary technical diploma or equivalent combination of education and experience
• 4+ years of experience assembling complex electromechanical assemblies
• Experience with precision microassembly techniques such as die attach, wire bonding, soldering, or adhesive application
• Ability to support fabrication process development and troubleshooting
• Strong mechanical aptitude, attention to detail, and manual dexterity when working with delicate components
• Experience with technical documentation, experimental records, and multi‑level BOMs
• Strong problem solving, communication, and collaboration skills
• Self‑motivated,…