Principal Packaging Architect: .5D/3D & Chiplet Leadership
Listed on 2026-09-29
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Engineering
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Design & Architecture
IC Resources is seeking a Principal Packaging Engineer to lead and define strategies for advanced 2.5D/3D packaging, heterogeneous integration and next-generation semiconductor systems across AI, HPC, RF, power and photonics. You will provide technical leadership, drive packaging roadmaps and oversee prototyping, qualification and collaboration with customers and partners.
The role requires a strong technical background and proven leadership experience to advance concepts from requirements to
Consider building your career as a Principal Packaging Architect: 2.5D/3D & Chiplet Leadership at IC Resources.
We are looking to fill the Principal Packaging Architect: 2.5D/3D & Chiplet Leadership position at IC Resources in Wales, United Kingdom.
The Principal Packaging Architect: 2.5D/3D & Chiplet Leadership role at IC Resources is now open for applications in Wales, United Kingdom.
Join us at IC Resources as our next Principal Packaging Architect: 2.5D/3D & Chiplet Leadership in Wales, United Kingdom.
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