Mixed-Signal Electronic Design Engineer

Overview

Draper is an independent, nonprofit research and development company headquartered in Cambridge, MA. The 2,000+ employees of Draper tackle important national challenges with a promise of delivering successful and usable solutions. From military defense and space exploration to biomedical engineering, lives often depend on the solutions we provide. Our multidisciplinary teams of engineers and scientists work in a collaborative environment that inspires the cross‑fertilization of ideas necessary for true innovation.

For more information about Draper, visit

A Mixed‑Signal Electronic Design Engineer designs, develops, tests, and oversees the manufacturing of electrical printed circuit boards (PCBs), analog and digital circuits, electronic equipment, sensors, motors, radar and navigation systems. In addition, the engineer develops architecture, performs simulations, physical layout, verifies and tests designs, and performs a variety of engineering activities throughout the life cycle to support planning, design, test, deployment, and sustainment.

The Tailored Systems Business Area within the Electronics Program Office delivers field‑ready microelectronics solutions in support of national security missions. The Draper team is chartered with supporting the nation's most challenging problems by providing an iterative and agile approach to innovative technical solutions and driving cutting‑edge technology development. This role will support a large multi‑disciplinary team as part of a long‑standing, fast‑paced contract.

• Support system architecture design and trade studies.
• Review and support proposal development and project execution.
• Understand detailed electrical analysis and design for mixed‑signal electronics.
• Perform schematic capture, simulation, and PCB layout/oversight; prototype bring‑up, debugging, functional verification, and performance characterization.

• Translate project and system requirements into well‑defined hardware architectures in collaboration with cross‑functional teams.
• Design and/or complete instruments including microprocessors, power, and analog components.
• Innovatively solve issues, drive completion of the project to schedule, and work collaboratively with other technical contributors.
• Build and test prototypes, debug, prepare documentation for manufacturing, and provide support.
• Research and enable innovative solutions for cutting‑edge designs.
• Engage other engineers and partners to develop reliable, cost‑effective solutions for products.
• Collaborate and communicate with management, internal teams, and development partners regarding design status, project progress, and issue resolution.
• Execute assignments independently with minimal oversight.
• Apply technical knowledge to solve problems.
• Contribute high‑quality content for technical reports and presentations with minimal guidance.
• Proactively identify needs and concerns associated with design decisions and communicate them to project leadership.
• Perform other duties as assigned.

• Proficiency in electronic design, microprocessor or embedded computing.
• Understanding of design and general computer architecture.
• Ability to write detailed design specifications.
• Computer programming and coding abilities.
• Excellent verbal and written communication skills.
• Strong mathematical, analytical, and problem‑solving skills.
• Excellent organizational skills and attention to detail.
• Strong time‑management skills and ability to meet deadlines.
• Ability to prioritize tasks.
• Thorough understanding of engineering theories and procedures.

Bachelor's degree in Electrical or Electronic Engineering or related field. Master's degree preferred.

3-5 years experience in Electronic or Electrical Engineering or related field.

• Technical capability with strong electrical engineering fundamentals.
• Experience leading teams of engineers as well as a background in developing new products or business.
• Experience in all of the following areas of electronic design: miniature low‑power embedded systems, sensor integration, wireless communication interfaces, battery conditioning and…