IC Packaging Design & Layout Engineer – 3D/SI Focus
Listed on 2026-10-06
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Engineering
Packaging Engineer, Manufacturing Engineer, Electronics Engineer, Hardware Engineer
Draper in Cambridge, MA, seeks an IC Packaging Design & Layout Engineer to lead end-to-end packaging for next-gen hardware. You will design substrates, interposers, and die-to-die routing using Siemens Xpedition, and collaborate with silicon, thermal/mechanical, and manufacturing teams to ensure manufacturability and reliability.
The role requires deep expertise in high-speed layout, SI/PI analysis, and design for manufacturability, with a focus on translating system requirements into robust
As a IC Packaging Design & Layout Engineer – 3D/SI Focus, you will play an important part at inuplands in Cambridge, MA, United States.
Are you ready to take on the IC Packaging Design & Layout Engineer – 3D/SI Focus role at inuplands?
We would love to welcome a new IC Packaging Design & Layout Engineer – 3D/SI Focus to our organisation in Cambridge, MA, United States.
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