Director of GaN Packaging Voltage Power Modules
Listed on 2026-10-16
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Engineering
Packaging Engineer
Cambridge GaN Devices Ltd. is seeking a Director of Packaging to lead our packaging team and advance high‑speed GaN power semiconductor packaging technologies in Cambridge, UK.
You will shape strategy, drive complex decisions, and partner with global suppliers and internal engineering partners to deliver best‑in‑class packaging solutions. The role blends strategic leadership with hands‑on technical work, requiring deep experience in power packaging, multiphysics simulation, and high-voltage
Our organisation is growing, and we are hiring a Director of GaN Packaging & High-Voltage Power Modules in Cambridge, England, United Kingdom.
The position is based in Cambridge, England, United Kingdom.
This opportunity is part of our work in Management & Operations, Engineering.
The advertised compensation is 90..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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