Senior Applications Engineer

Full time | Circle Strategies, Inc. | United States

Posted On 10/20/2026

Work Experience 5+ years

$120,000–$140,000

City Canton

State/Province Massachusetts

02021

Senior Applications Engineer

Thick Film Substrates, Modules, and Microelectronics Assembly

REMTEC | Canton, Massachusetts | Primarily On-Site | $120,000–$140,000

Do you enjoy solving complex engineering challenges, working directly with customers, and helping fellow engineers succeed? Remtec is seeking a Senior Applications Engineer to connect customer requirements with practical, high-performance electronics manufacturing solutions—and lead a small applications engineering team.

This opportunity is well suited for an experienced applications or product engineer who enjoys customer interaction and is ready to expand their leadership impact. Experience with thick-film ceramics is valuable, but strong PCB design and layout experience can provide a foundation for success.

Remtec specializes in advanced ceramic packaging technology, printed circuit boards (PCBs), substrates, and components used throughout the electronics industry. We work with customers to develop specialized solutions for demanding applications, bringing together technical design, manufacturing expertise, and collaborative problem‑solving.

• Lead, mentor, and support a team of three applications engineers, setting priorities, providing technical guidance, and supporting performance and professional development.
• Serve as a key technical contact for customers, manufacturers’ representatives, sales, engineering, and manufacturing teams.
• Understand customer design requirements; review PCB layouts and electronic designs; recommend substrate, packaging, and assembly approaches that improve manufacturability and performance.
• Guide customer design‑in activities, design reviews, prototypes, new product introductions, and transitions into production.
• Prepare and review technical quotations, cost estimates, and feasibility assessments; learn and apply Remtec’s pricing methodology.
• Partner with manufacturing, production, and quality teams to troubleshoot technical challenges, address root causes, and improve quality, yield, and process capability.
• Create technical presentations, application documentation, and customer reports; participate in customer visits and relevant industry events.

• Bachelor’s degree in Electrical, Mechanical, Manufacturing, or Materials Science Engineering, or a related technical discipline.
• At least five years of relevant engineering experience in electronics design, PCB technologies, electronics manufacturing, microelectronics, packaging, or related fields.
• Working knowledge of PCB design, circuit layout, and design for manufacturability, with practical CAD experience (such as AutoCAD, Solid Works, or comparable tools).
• Ability to communicate technical concepts clearly to customer engineers and internal teams, evaluate design tradeoffs, and recommend solutions.
• Strong analytical, project coordination, and cross‑functional collaboration skills; enthusiasm for customer‑facing engineering and team leadership.
• Ability to work primarily on‑site and travel for customer visits and business needs.

• Knowledge of die attach, wire bonding, flip‑chip, SMT, laser trimming, soldering, hermetic packaging, or related assembly processes.
• Experience mentoring or managing engineers; technical quotations, cost estimating, or customer‑facing project management.
• Exposure to aerospace, defense, medical, RF/microwave, or other high‑reliability electronics, including applicable quality and manufacturing standards.

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