Senior RFIC Design Engineer

Company Overview

Novomorphic is a new semiconductor design venture backed by Cadence Design Systems, Welsh Government, and CSA Catapult. We have been established to build critical semiconductor design capability in the UK.

Our focus is advanced integrated circuit and electronic system design, with particular strength in low‑power intelligent hardware, edge AI, digital design, analogue and mixed‑signal systems, and compound semiconductor technologies.

We are building Novomorphic from the ground up. That means every person who joins us will help shape the company, its technical capability, and its culture. We value technical excellence, ownership, curiosity, collaboration, and practical delivery.

Novomorphic is looking for a Senior RFIC Design Engineer to lead the development of high-performance RF and microwave front‑ends, transceivers, RF system-in-package designs, and multi-chip module solutions for advanced communications and sensing applications.

This is a senior technical role for an engineer who can take ownership of complex RF and mixed‑technology designs from concept through simulation, layout supervision, evaluation, characterisation, and validation. The role combines deep RFIC design, system‑level thinking, practical delivery, and close collaboration with package, layout, test, and wider engineering teams.

As a Senior RFIC Design Engineer, you will be responsible for product development of RF system-in-package and multi‑chip module designs across a range of target markets.

You will design RF receive and transmit signal chains, RF cores, signal interfaces, and co‑packaged mixed‑technology systems using modern RF, microwave, analogue, electromagnetic, and thermal design workflows. You will also help define technical direction, guide layout activity, support technology selection, and contribute to the delivery of robust communication systems.

• Lead the design and development of RFICs, RF receive and transmit signal chains, RF cores, and the signal interfaces that support those chains.
• Develop high‑performance RF and microwave front‑ends and transceivers for complex communication systems.
• Design low‑noise amplifiers and signal‑chain blocks such as quadrature mixers, low phase‑noise PLLs, TX blocks, PA driver stages, switches, attenuators, VCOs, and amplifiers.
• Apply strong analogue, mixed‑signal, and RF design judgement across architecture, circuit design, simulation, verification, and implementation.

• Develop co‑packaged mixed‑technology designs using current tools and methodologies.
• Design RF signal chains using multiple RF and analogue components across different semiconductor technologies within a single package.
• Support package‑level design decisions, including RF and microwave package requirements, package modelling, and thermal management.
• Contribute to technology node and PDK selection and evaluation for RF, microwave, analogue, and mixed‑signal applications.

• Use best‑practice design and verification techniques, tools, and flows to produce efficient designs that meet specification.
• Simulate RF signal chains and package models using advanced circuit, system, electromagnetic, and thermal simulation tools.
• Verify system performance at behavioural, architectural, circuit, and signal‑chain level.
• Perform design evaluation, characterisation, validation, and detailed analysis of IC performance.

• Supervise RF and microwave layout activity and provide clear technical direction to layout engineers.
• Undertake layout work where needed, particularly for sensitive RF, microwave, and high‑frequency blocks.
• Lead high‑calibre teams in the design and layout of RF and microwave integrated circuits.
• Document design decisions, raise risks early, communicate trade‑offs clearly, and support delivery against project commitments.

• Advanced RF and microwave IC blocks for high‑performance communication and sensing systems.
• RF receive and transmit signal chains, front‑ends, transceivers, and signal interfaces.
• Co‑packaged…