Failure Analysis Engineer III: PCB Root-Cause Temp
Listed on 2026-10-07
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Engineering
Quality Engineering, Electronics Engineer, Process Engineer, Test Engineer
HM Electronics Inc is seeking a Failure Analysis Engineer III for a temporary (3 months) position in Carlsbad, CA. The role focuses on analyzing top PCB failure modes, identifying root causes, and implementing countermeasures in collaboration with Manufacturing and QA teams.
The candidate will develop analysis tools, contribute to MES data feedback, and drive continuous improvement through Pareto-chart driven activities.
As a Failure Analysis Engineer III: PCB Root-Cause Temp (3mo), you will play an important part at HM Electronics Inc in Carlsbad, CA, United States.
The advertised compensation is 63.369 - 84.033.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Failure Analysis Engineer III: PCB Root-Cause Temp (3mo) role in the description above.
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