Director of Engineering; Packaging

Overview
We’re seeking a strategic and technically strong Director of Packaging to lead packaging innovation and technology coordination within the business unit. This role is critical in shaping our product development efforts through advanced packaging design, technology planning, and design automation. You'll work cross-functionally with engineering, manufacturing, IT, and sourcing teams to drive roadmap execution, enable scalability, and improve design methodologies.

Key Responsibilities

• Packaging Leadership:

  • Own and drive the business unit’s packaging roadmap, focusing on technologies such as LGA, dual-side BGA, wire bond, and flip-chip.

  • Collaborate with engineering teams to plan platforms in advance of development cycles.

  • Lead initiatives to reduce package size by 20% annually.

  • Coordinate closely with manufacturing partners and internal stakeholders to align technology capabilities.

  • Oversee test vehicle builds to validate concepts and support future technologies.

• Technology Strategy:

  • Track and report technology usage to support capacity and diversification planning.

  • Maintain oversight of process technologies (SOI, Si, HBT/BiHEMT, BAW/TCSAW) used in new products.

• Design Automation & Tools:

  • Partner with DA teams to improve tool flows (Cadence Virtuoso, ADS, HFSS, EMX).

  • Drive automation and 3D packaging integration across module design processes.

• Development & Prototyping:

  • Support proto line development and ensure smooth transition to production.

  • Interface with design teams and suppliers to align packaging needs and enable new solutions.

  • Manage EVB development and ensure vendor capabilities match evolving product requirements.

• IT & Systems Integration:

  • Collaborate with IT to enhance internal tools, databases, and documentation systems (Agile, SharePoint, SQL, etc.).

  • Drive improvements in data systems supporting packaging and design processes.

Qualifications

• BS with 15+ years, MS with 12+ years, or PhD with 8+ years in semiconductor packaging or related field

• Strong expertise in:

  • Packaging & PCB technologies

  • Design for manufacturing & reliability

  • Electrical simulation tools

  • Product and test engineering

  • Cross-functional team leadership

Compensation & Benefits
Salary range: $166,600 – $333,100 USD, depending on experience and location.
Benefits include: premium-free medical plan, 401(k) with match, ESPP, paid time off (vacation, parental, wellness), bonus eligibility, and performance-based equity.