Principal Materials & Process Engineer; Onsite

Date Posted:  Country:
United States of America

Location:

US-IA-CEDAR RAPIDS-121 ~ 350 Collins Rd NE ~ BLDG 121 Position Role Type:
Onsite U.S. Citizen, U.S. Person, or Immigration Status Requirements: U.S. citizenship is required, as only U.S. citizens are authorized to access information under this program/contract. Security Clearance Type:
None/Not Required Security Clearance Status:
Not Required

At RTX, the world's largest aerospace and defense company, 185,000 great minds are united by purpose and inspired to make a difference solving the world’s most complex problems. With our three market leading businesses, world‑class operations and investments in research and development, we offer capabilities and opportunity no one else can. Together, we push the boundaries of known science and find new ways to connect and protect our world.

Collins Aerospace is a leader in technologically advanced, intelligent solutions that help redefine the aerospace and defense industry. With a comprehensive portfolio and deep technical expertise, we help customers meet the demands of the global market. Join us and help shape the future of aerospace and defense.

• Provide technical leadership for photolithography processes
• Establish and maintain critical process parameters, equipment calibration methods, SPC limits, acceptance criteria, and advanced monitoring strategies for lithography systems.
• Support troubleshooting of issues involving CD variation, resist adhesion, profile defects, contamination, overlay accuracy, pattern collapse, and environmental sensitivities.
• Partner with Manufacturing Engineering, Process Engineering, Quality, Operations, and Design to investigate nonconformances, yield excursions, and process variation using structured root‑cause analysis and corrective actions.
• Develop, optimize, qualify, and standardize photolithography and wafer process flows to improve yield, cycle time, equipment utilization, and cost.
• Lead continuous improvement initiatives targeting defect reduction, overlay accuracy, CD uniformity, and reduction of rework and process variability.
• Develop and maintain photolithography specifications, work instructions, process controls, and best‑practice guidelines.
• Support qualification and integration of new photoresists, mask sets, exposure tools, metrology systems, and wafer materials.
• Lead root‑cause analysis and corrective actions for lithography‑related yield losses and production issues.
• Support new product introduction, process validation, PFMEA, control plans, mask review, and production readiness.
• Ensure all processes comply with customer, regulatory, environmental, safety, and industry requirements.

Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and minimum 8 years prior relevant experience or an Advanced Degree in a related field and minimum 5 years of experience. Experience supporting lithography processes.

• Degree in Engineering, Materials Science, Chemistry, Physics, Microelectronics, or a related field
• Direct experience with semiconductor photolithography processes: resist material, mask alignment, exposure, developing, and metrology.
• Experience with wafer‑level chemical processes and surface preparation.
• Hands‑on experience with lithography materials characterization (SEM, CD‑SEM, optical microscopy, overlay metrology, particle analysis).
• Practical experience troubleshooting lithography defects and process excursions.
• Experience in a semiconductor, microelectronics, MEMS, or other highly regulated manufacturing environment.
• Familiarity with industry process control and quality systems.
• Experience supporting low‑to‑high‑volume or high‑mix production environments.
• Unders…