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Senior Packaging Engineer: -Perf AI Hardware; Hybrid

Job in City Of London, Central London, Greater London, England, UK
Listing for: Platform Recruitment
Full Time position
Listed on 2026-07-21
Job specializations:
  • Engineering
    Packaging Engineer, Electronics Engineer, Hardware Engineer
Salary/Wage Range or Industry Benchmark: 70000 - 110000 GBP Yearly GBP 70000.00 110000.00 YEAR
Job Description & How to Apply Below
Position: Senior Packaging Engineer: High-Perf AI Hardware (Hybrid)
Location: City Of London

Platform Recruitment's client in London is seeking an experienced Senior / Staff Packaging Engineer to lead advanced semiconductor packaging from concept to production. You will work on package, substrate and system-level integration for high-performance devices, collaborating with ASIC, hardware and systems teams to deliver cutting-edge packaging solutions.

The role involves cross-disciplinary development across design, layout, simulation, and product development, with a hybrid working model in

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Position Requirements
10+ Years work experience
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