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Die Bonding Applications Engineer — Advanced Packaging

Job in Chandler, Maricopa County, Arizona, 85249, USA
Listing for: Finetech
Full Time position
Listed on 2026-01-05
Job specializations:
  • Engineering
    Electrical Engineering, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below
A leading capital equipment company in Arizona is seeking an experienced Applications Engineer to become part of their innovative team. In this role, you will provide technical support to our sales team and customers while working on state-of-the-art die bonding equipment. The ideal candidate should have a degree in Electrical Engineering and 3–5 years of relevant experience in semiconductor manufacturing.

This opportunity offers competitive salary and benefits, and a chance to impact the semiconductor industry directly.
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