Principal Packaging Engineer — Power Density
Listed on 2026-10-11
-
Engineering
Packaging Engineer, Electrical Engineering
NXP Semiconductors NV in Chandler, AZ is seeking a Senior Semiconductor Packaging Engineer to lead package development for new products and technologies across business lines. You will define architectures, materials, structures, and assembly processes to meet reliability, performance, manufacturability, and cost targets.
You will drive cross-functional programs with Marketing, Design, Product Engineering, and external partners, monitor advances in PLP and power packaging, and support NPI/NTI
This role is for the Principal Packaging Engineer — Power & High-Density role at NXP Semiconductors NV.
We appreciate your interest in this position.
Join NXP Semiconductors NV and contribute to our ongoing work.
Take a moment to read everything above and see whether this role is right for you.
This posting is for the Principal Packaging Engineer — Power & High-Density role at NXP Semiconductors NV, based in Chandler, AZ, United States.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).