Advanced Packaging Process Engineer – Semiconductors
Listed on 2026-10-11
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Engineering
Process Engineer, Packaging Engineer, Manufacturing Engineer
Intel Corporation in Arizona seeks a Packaging Process Development Engineer to advance next-generation semiconductor packaging technologies. You will develop and optimize assembly media and collateral processes, applying DOE and SPC to deliver reliable, cost-effective solutions.
Qualifications include a Bachelors or Masters in a relevant STEM field with 2+ years of experience, and proficiency with Solid Works/AutoCAD and GD&T.
The Advanced Packaging Process Engineer – Semiconductors role at Intel Corporation is now open for applications in Chandler, AZ, United States.
All applications are reviewed carefully by our team.
The position is based in Chandler, AZ, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 99..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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