Sr Substrate Yield Lead

Intel Corporation is seeking a high-impact Yield Development Engineer to drive yield performance for cutting-edge manufacturing processes within the Substrate Technology and Development (SPTD) organization. In this role, you will own end-to-end yield improvement initiatives, leveraging your expertise in data analysis, defect resolution, and designnd transform the future of technology.

Intel’s APTM organization is seeking a highly driven and execution-focused EMIB-T Substrate Yield Lead to lead yield performance for next-generation advanced packaging technologies, including
EMIB-T (Embedded Multi-die Interconnect Bridge with TSV), Intel’s most advanced platform for heterogeneous integration. This is a high-visibility, high-accountability role with significant responsibility for enabling successful technology development and manufacturing readiness across both
Intel Foundry Services (IFS)and
Intel Product Groups (IPG).

The ideal candidate is a self-starter who thrives in ambiguous and fast-paced environments, proactively drives issues to closure, and requires minimal supervision. Success in this role requires strong technical depth, urgency in execution, the ability to influence cross-functional teams and suppliers, and a relentless focus on delivering yield and program milestones.

Business group

The SPTD Yield group is part of Intel Corporation and plays a critical role in driving innovation and delivering high-performance yield solutions that enable advanced semiconductor manufacturing. This team focuses on yield ownership, supplier engagement, and defect resolution, ensuring manufacturing excellence for Intel’s cutting-edge technologies. By joining this group, you will collaborate across disciplines to support Intel’s broader mission of delivering transformative and impactful technology solutions.

Key Responsibilities

• Lead process yield ownership, driving root cause analysis (RCA) and corrective actions for yield excursions.
• Establish real-time yield monitoring dashboards and actionable performance metrics.
• Serve as the primary technical interface with substrate suppliers to drive process accountability, defect reduction, and yield enhancement.
• Partner with design and integration teams to optimize design rules and improve yield robustness through DFM and DFY initiatives.
• Perform statistical data analysis using tools such as JMP and SQL scripting to identify yield limiters and develop solutions.
• Apply advanced analytics or machine learning techniques to improve yield prediction and defect classification.
• Collaborate with cross-functional teams to solve complex technical challenges, supporting Intel’s high-visibility manufacturing programs.

Behavioral traits

• Demonstrated success in problem-solving for semiconductor manufacturing yield improvements.
• Effective collaboration and communication skills to drive results across multidisciplinary teams.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• Bachelor’s degree in Materials Science and Engineering, Mechanical Engineering, Computer Science, Information Systems, Chemical Engineering, Electrical Engineering, Physics, or Chemistry or related field, with 9+ years of experience,
  OR a Master’s degree with 6+ years of experience,
  OR a PhD with 4+ years of experience
• 4+ years of experience in at least 3 of the following areas:
  • Statistical analysis tools (e.g., JMP) and scripting (e.g., SQL) for data analytics.
  • Yield analysis methodologies, defect density reduction, and process control.
  • Semiconductor fabrication processes, process…