Senior IC Packaging Design Engineer Substrates
Listed on 2026-10-13
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Engineering
Packaging Engineer
Tessolve Semiconductors is hiring IC Packaging Design Engineers for Chandler, AZ (primary) or Hillsboro, OR (secondary). Senior candidates with 10+ years are preferred; mid-level (4–6+ MS / 6+ BS) are also considered.
You’ll design IC packages, drive substrate layout, and ensure reliability, manufacturability, and SI/PI-aware implementations. Join a leading semiconductor engineering firm and work on cutting-edge packaging projects with flexible location options in Chandler, AZ or Hillsboro, OR.
We are seeking a motivated Senior IC Packaging Design Engineer — High-Performance Substrates to join Tessolve in Chandler, AZ, United States.
Join Tessolve and contribute to our ongoing work.
Take a moment to read everything above and see whether this role is right for you.
This posting is for the Senior IC Packaging Design Engineer — High-Performance Substrates role at Tessolve, based in Chandler, AZ, United States.
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