IC Packaging Design Engineer — EM Modeling & NPI Impact
Listed on 2026-10-15
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Engineering
Packaging Engineer, Electronics Engineer, Systems Engineer
NXP Semiconductors NV in Chandler, AZ, seeks an experienced RF packaging engineer to design optimized package solutions for new products. You will model EM behavior, drive electrical performance, and collaborate with SoC/PCB teams to enhance IO and power delivery across packaging designs.
The role requires a strong background in microelectronics packaging, RF modeling, and relevant tool proficiency. This position is on-site in Chandler with competitive compensation and benefits.
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This is a genuine role to take on the IC Packaging Design Engineer — EM Modeling & NPI Impact role at NXP Semiconductors NV.
As a IC Packaging Design Engineer — EM Modeling & NPI Impact, you will play an important part at NXP Semiconductors NV in Chandler, AZ, United States.
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