Module Engineer - Foundry Packaging & Process Improvement
Listed on 2026-10-16
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Engineering
Manufacturing Engineer, Process Engineer, Quality Engineering, Packaging Engineer -
Manufacturing / Production
Manufacturing Engineer, Quality Engineering, Packaging Engineer
Intel Corporation in Chandler, Arizona is seeking a Module Engineer to develop and optimize assembly processes and equipment for the next‑generation foundry packaging platform.
You will join the Foundry Technology Manufacturing group, collaborating across engineering, manufacturing, and technology development to deliver world‑class packaging solutions for our foundry customers, applying DOE, SPC, reliability testing, and continuous improvement to ensure manufacturability and quality.
We are seeking a motivated Module Engineer
- Foundry Packaging & Process Improvement to join Intel Corporation in Chandler, AZ, United States.
Are you ready to take on the Module Engineer
- Foundry Packaging & Process Improvement role at Intel Corporation?
We would love to welcome a new Module Engineer
- Foundry Packaging & Process Improvement to our team in Chandler, AZ, United States.
For the Module Engineer
- Foundry Packaging & Process Improvement position at Intel Corporation, we are reviewing applications now.
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