ATD Laser Development Engineer

Job Details:

Job Description:

The Role and Impact Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers a unique opportunity to contribute to the development of cutting-edge processes and equipment that enable Intel to stay at the forefront of innovation. Your work will directly impact the performance, quality, and reliability of Intel's assembly and packaging solutions, driving advancements in technology that address the dynamic needs of the semiconductor industry.

Through technical expertise and collaboration with cross-functional teams, you will help Intel achieve its mission of delivering world-class packaging solutions.

• Design and develop laser assembly packaging processes and equipment to enable next-generation packaging technologies.
• Optimize manufacturing processes to meet stringent quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Develop process and equipment specifications using Design of Experiments (DOE) and data analysis principles.
• Oversee the manufacturability of physical layout designs and manage the full cycle of packaging processes, procedures, and flows.
• Establish laser process specifications and collaborate with suppliers to meet quality and performance standards.
• Innovate new techniques, tools, and quality screens for early identification of potential packaging quality and reliability issues.
• Set laser process reliability requirements based on a strong understanding of failure mechanisms, influencing design, material selection, and process development.
• Drive standardization in qualification procedures, manufacturing quality systems, and processes while collaborating with engineering teams to meet critical milestones.

• Bachelor's degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field OR Master's degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field
• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Fundamental understanding of laser and optical systems

• Hands-on experience in a technology manufacturing environment or semiconductor packaging processes and troubleshooting laser based equipment/systems.
• Familiarity with equipment adjustment, process characterization, and manufacturability in semiconductor or electronics assembly.
• Demonstrated ability to collaborate with cross-functional teams and deliver results in time-sensitive projects.
• Capability to apply Data Science and Statistics tools (Python, Numpy/Pandas, SQL, JMP, Minitab) to manipulate large complex data sets.

We invite you to bring your expertise, creativity, and passion for technology innovation to Intel. Join us in driving the future of semiconductor packaging and make a lasting impact on the technology landscape.

College Grad

Shift 1 (United States of America)

US, Arizona, Phoenix

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.

N/A

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

$85,.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

This role will require an on-site presence.

Job posting details (such as work model, location or time type) are subject to change.

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring…